Temporary protective film for manufacturing semiconductor devices



FIG. 1.1 is a perspective view of a temporary protective film formanufacturing semiconductor devices showing my design;

FIG. 1.2 is a front view thereof;

FIG. 1.3 is a back view thereof;

FIG. 1.4 is a top view thereof;

FIG. 1.5 is a bottom view thereof;

FIG. 1.6 is a left side view thereof;

FIG. 1.7 is a right side view thereof;

FIG. 1.8 is a vertical cross-sectional view passing through the centerof FIG. 1.6.

FIG. 3.1 is a perspective view of a temporary protective film formanufacturing semiconductor devices showing my design;

FIG. 3.2 is a front view thereof;

FIG. 3.3 is a back view thereof;

FIG. 3.4 is a top view thereof;

FIG. 3.5 is a bottom view thereof;

FIG. 3.6 is a left side view thereof;

FIG. 3.7 is a right side view thereof;

FIG. 3.8 is a vertical cross-sectional view passing through the centerof FIG. 3.6.

Each article includes a core part and a film part, and is characterizedby the fact that the width of the core part is larger than the width ofthe film part, and the core part protrudes greatly to one side; eacharticle is temporarily attached to a back of a lead frame whenmanufacturing a semiconductor device with only one side encapsulated andthe lead frame on the back side exposed; the film part of each articlehas an adhesive layer on one side; each article is easy to position whenset on a manufacturing equipment. The parallel thin lines in therepresentation represent contours only and do not illustrate anornamentation or decoration on the surface of the product.

CLAIM The ornamental design for a temporary protective film formanufacturing semiconductor devices, as shown and described.